Study on preparation and conductivity of SiCp /Cu gradient composites

SiCp/Cu gradient composites were fabricated by powder metallurgy using the process of dual-directional extrusion of the floating die. The microstructure and conductivity of SiCp/Cu graded composites were studied by optical microscope and current conductivity instrument. The results show that the SiCp/Cu gradient composites are continuous, and the distribution of reinforced particles is gradient. The average density of SiCp/Cu gradient composites is enhanced 7.1% and conductivity is increased 7.8% by re-pressing and re-sintering processes. After the compression deformation, the microstructure becomes denser, and the maximum density reached to 96.1%. The conductivity of SiCp/Cu gradient composites decreased gradually from the Cu matrix to the surface.