Title :
Evaluation of line edge roughness in nanoimprint using photo-curable polymer
Author :
Kurashima, Y. ; Komuro, M. ; Hiroshima, H. ; Taniguchi, J. ; Miyamoto, I.
Author_Institution :
Adv. Semicond. Res. Center, Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba, Japan
Abstract :
Nanoimprint technology is attractive for fabrication technique of patterns below 100-nm dimension. We have already attempted to replicate a mold pattern onto a liquid polymer solidified with UV light irradiation in order to avoid a deformation due to thermal expansion and succeeded to transfer pattern with 60 nm line-width. However the transfer pattern had a fluctuation in line width, mainly due to fluctuation of mold pattern itself. It is strongly required to demonstrate the ultimate accuracy of the replicated pattern in photo-curable nanoimprint and to investigate a line edge roughness (LER). In order to make clear this problem, we examined characteristics of the LER in photo-curable imprint using a mold with atomically flat sidewall.
Keywords :
curing; lithography; moulding; nanotechnology; polymers; 60 nm; UV light irradiation; line edge roughness; mold pattern replication; nanoimprint lithography; photocurable polymer; Anisotropic magnetoresistance; Electronics industry; Fabrication; Fluctuations; Industrial electronics; Plastics industry; Polymers; Scanning electron microscopy; Textile industry; Thermal expansion;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2002. Digest of Papers. Microprocesses and Nanotechnology 2002. 2002 International
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-031-3
DOI :
10.1109/IMNC.2002.1178592