DocumentCode
3165135
Title
An 8 ns BiCMOS 1 Mb ECL SRAM with a configurable memory array size
Author
Tran, H. ; Fung, K. ; Bell, D. ; Chapman, R. ; Harward, M. ; Suzuki, T. ; Havemann, R. ; Eklund, R. ; Fleck, R. ; Le, D. ; Wei, C. ; Iyengar, N. ; Rodder, M. ; Haken, R. ; Scott, D.
Author_Institution
Texas Instrum. Inc., Dallas, TX, USA
fYear
1989
fDate
15-17 Feb. 1989
Firstpage
36
Lastpage
37
Abstract
A 1-Mb*1 BiCMOS ECL (emitter-coupled-logic) I/O SRAM (static random access memory) is fabricated using a 0.8- mu m BiCMOS process. This memory device utilizes a 76- mu m/sup 2/ full-CMOS six-transistor memory cell, a dual-MOS current-source BiCMOS bit line sensing scheme, a BiCMOS current-source voltage reference network, and a low-capacitance load block line decoding circuit to achieve 8-ns access time. The configurable memory array size architecture allows for memory sizes from 64 kb up to 1 Mb in 64 kb increments with no change in the peripheral circuits. The six-transistor cell layout is shown, and the memory block architecture is illustrated. The low dependence of power supply current on the operating frequency shows the impact of ECL circuits in the design. Characteristics of the SRAM are summarized.<>
Keywords
BIMOS integrated circuits; emitter-coupled logic; integrated memory circuits; memory architecture; random-access storage; 0.8 micron; 1 Mbit; 8 ns; BiCMOS ECL I/O SRAM; BiCMOS current-source voltage reference network; access time; configurable memory array size; dual-MOS current-source BiCMOS bit line sensing scheme; full-CMOS six-transistor memory cell; low-capacitance load block line decoding circuit; memory block architecture; operating frequency; power supply current; static random access memory; BiCMOS integrated circuits; CMOS logic circuits; Decoding; Delay effects; Instruments; Integrated circuit interconnections; Power supplies; Process design; Random access memory; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 1989. Digest of Technical Papers. 36th ISSCC., 1989 IEEE International
Conference_Location
New York, NY, USA
Type
conf
DOI
10.1109/ISSCC.1989.48223
Filename
48223
Link To Document