Title :
Fabrication of diamond mold for imprint lithography
Author :
Konoma, C. ; Ono, T. ; Miyashita, H. ; Kanomori, Y. ; Esashi, M.
Author_Institution :
Dept. Mechatronics & Precision Eng., Tohoku Univ., Sendai, Japan
Abstract :
The authors propose the fabrication method for a diamond mold for imprint lithography to transfer the dot pattern onto recording media. It is expected that more high density and small dot patterns will be imprinted using the diamond mold. A diamond thin film with a thickness of about 10 /spl mu/m was deposited on a Si wafer using hot-filament chemical vapor deposition (HF-CVD). The wafer with the diamond film was anodically bonded with 5 mm thick Pyrex glass via sputtered Al film as an adhesive layer. An aligned hole pattern can be successfully transferred on the diamond film by oxygen fast atom beam etching.
Keywords :
adhesion; aluminium; chemical vapour deposition; diamond; elemental semiconductors; etching; hard discs; moulding; nanolithography; semiconductor thin films; silicon; 10 micron; 5 mm; Al; C; HF-CVD; O fast atom beam etching; Pyrex glass; Si; Si wafer; diamond mold; diamond thin film; dot pattern transfer; fabrication method; film thickness; hole pattern transfer; hot-filament chemical vapor deposition; imprint lithography; recording media; sputtered Al adhesive layer; Atomic beams; Atomic layer deposition; Chemical vapor deposition; Fabrication; Glass; Lithography; Semiconductor thin films; Sputter etching; Sputtering; Wafer bonding;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2002. Digest of Papers. Microprocesses and Nanotechnology 2002. 2002 International
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-031-3
DOI :
10.1109/IMNC.2002.1178595
