DocumentCode :
3165347
Title :
Microwave dielectric properties of BaO-TiO2-WO3 ceramics sintered with glasses
Author :
Takada, Takahiro ; Wang, Sea Fue ; Yoshikawa, Shoko ; Jang, Sei-Joo ; Newnham, Robert E.
Author_Institution :
Mater. Res. Lab., Pennsylvania State Univ., University Park, PA, USA
fYear :
1991
fDate :
33457
Firstpage :
626
Lastpage :
629
Abstract :
The microwave dielectric properties and the sintering behavior of commercial BaO-TiO2-WO3 dielectrics, N-35, with addition of various glasses; (1) simple glass formers, (2) ZnO-B2 O3 based, (3) B2O3-SiO2 based and (4) Al2O 3-SiO2 based glasses were studied. The Q of N-35 sintered with a ZnO-B2O3 glass system showed a sudden drop in the sintering temperature to around 1000°C. Results of XRD, thermal analysis and scanning electron microscopy suggest that the chemical reaction between N-35 and the glass had a larger effect on Q than density. A 5wt% addition of B2O3 to N-35, when sintered at 1200°C, had the best dielectric properties, Q=8300 and K=34.1 at 8.5 GHz, among the glasses Q, K and density increased with sintering temperature from 1000 to 1200°C. The effects of the amount of glass added and the mixing method on the density and the dielectric properties will be discussed
Keywords :
Q-factor; X-ray diffraction; barium compounds; ceramics; composite materials; dielectric losses; ferroelectric materials; glass; permittivity; scanning electron microscopy; sintering; thermal analysis; titanium compounds; tungsten compounds; 1000 C; 1200 C; 8.5 GHz; Al2O3-SiO2; Al2O3-SiO2 glass; B2O3-SiO2; B2O3-SiO2 glass; BaO-TiO2-WO3; BaO-TiO2-WO3 ceramics; XRD; ZnO-B2O3; ZnO-B2O3 glass; chemical reaction; dielectric properties; microwave dielectric properties; scanning electron microscopy; sintering behavior; thermal analysis; Atmosphere; Ceramics; Dielectric materials; Firing; Glass; Permittivity; Powders; Skin; Temperature; X-ray scattering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applications of Ferroelectrics, 1994.ISAF '94., Proceedings of the Ninth IEEE International Symposium on
Conference_Location :
University Park, PA
Print_ISBN :
0-7803-1847-1
Type :
conf
DOI :
10.1109/ISAF.1994.522448
Filename :
522448
Link To Document :
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