DocumentCode :
3165356
Title :
Meeting the challenges of the distributed power environment
Author :
Magnani, Nicholas J. ; Tarantino, Frank L.
Author_Institution :
Yuasa Inc., Reading, PA, USA
fYear :
1998
fDate :
1998
Firstpage :
173
Lastpage :
179
Abstract :
The movement from the central office to a distributed power architecture results in both changes in how batteries are used and their environment. The location of batteries with electronic equipment drives the use of VRLA products and contributes to the requirement for products that will endure higher temperatures. Batteries in distributed systems will, in all probability, experience more frequent and more severe usage. However, improvements in VRLA technology and new products entering the market provide increased options and the opportunity to select the right product for these applications. Tubular lead/acid products represent one of these options and should be considered when deep and/or extensive cycling is required. Cycle life in excess of 1200, 100% depth-of-discharge cycles have been demonstrated. While the higher temperatures encountered in these uncontrolled environments arguably present the greatest challenge to battery life, improvements have been made that enhance resistance to thermal-runaway and increase float life at elevated temperatures
Keywords :
lead acid batteries; telecommunication power supplies; Pb; Pb-acid valve regulated battery; VRLA; cycle life improvement; cycling; depth-of-discharge cycles; distributed power architecture; distributed power environment; electronic equipment; higher temperatures; increased float life; resistance enhancement; thermal-runaway; tubular lead/acid products; uncontrolled environments; Batteries; Central office; Corrosion; Electrodes; Electronic equipment; Glass; Manufacturing; Power system reliability; Temperature; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Telecommunications Energy Conference, 1998. INTELEC. Twentieth International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-5069-3
Type :
conf
DOI :
10.1109/INTLEC.1998.793495
Filename :
793495
Link To Document :
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