DocumentCode

3165416

Title

Studies on a novel flip-chip interconnect structure - pillar bump

Author

Wang, Tie ; Tung, Francisca ; Foo, Louis ; Dutta, Vivek

Author_Institution

Advanpack Solutions Pte Ltd.

fYear

2001

fDate

2001

Firstpage

933

Lastpage

937

Keywords

Assembly; Copper; Environmentally friendly manufacturing techniques; Lead; Packaging; Shape; Stress; Testing; Tin; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927917

Filename

927917