Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder

Author

Jang, Se-Young ; Wolf, Juergen ; Ehrmann, Oswin ; Gloor, Heinz ; Reichl, Herbert ; Paik, Kyung-Wook

Author_Institution

Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea

fYear

2001

fDate

2001

Firstpage

950

Lastpage

956

Abstract

For the future electronic packaging, a high density and environmentally friendly interconnection technology is urgently needed. This paper suggests a Pb-free electroplated bumping process for high density interconnection. We describe a newly defined eutectic Sn/3.5Ag solder bumping process using an alloy electroplating method and introduce the UBM (Under Bump Metallurgy) study for electroplated Sn/3.5Ag bumps. Four different types of UBM layers were selected and investigated. The bumping process and UBM interface reactions of Sn/3.5Ag were compared with those of Pb/63Sn which is most commonly used as a solder bumping material

Keywords

electroplated coatings; eutectic alloys; lead alloys; packaging; silver alloys; soldering; tin alloys; Sn-Ag; Sn-Pb; electronic packaging; electroplated eutectic solder; high density interconnection; under bump metallurgy; Adhesives; Electronics packaging; Flip chip; Lead; Materials science and technology; Production; Surface-mount technology; Temperature; Thermal resistance; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927920

Filename

927920