Title :
High speed multichip modules using flip chip mount technology for 10 Gbps optical transmission systems
Author :
Takahashi, Kazufumi ; Ikeuchi, Takao ; Tsuda, Toshimasa ; Chuzenji, Tomohiro
Author_Institution :
NEC Corp., Kawasaki, Japan
Abstract :
This Paper describes small-sized multichip modules (MCMs) for 10 Gbps optical transmission systems. We have developed three kinds of MCMs. MCMs include LSIs we have newly developed by employing SiGe bipolar process. Each kind of MCM is composed of an alumina substrate with flat lead frames, LSIs mounted by flip chip mount technology, passive SMT components, and a heat spreader. To achieve wide-band characteristics of MCMs, the grounded coplanar waveguide design is adopted for the transmission lines on MCMs. The heat spreader is attached to the backside of each LSI through thermally conductive silicone compound for highly effective cooling. These MCMs have been applied for our 10 Gbps optical transmitter and receiver modules in the wavelength division multiplexing (WDM) system, and achieved 1.6 Tbps (10 Gbps×160 channels) of transmission capacity
Keywords :
flip-chip devices; multichip modules; optical communication equipment; 10 Gbit/s; Al2O3; LSI; SiGe; SiGe bipolar process; alumina substrate; coplanar waveguide; flip-chip mount technology; heat spreader; high-speed multichip module; lead frame; optical receiver module; optical transmission system; optical transmitter module; passive SMT component; silicone compound; transmission line; wavelength division multiplexing; Flip chip; Germanium silicon alloys; High speed optical techniques; Multichip modules; Optical receivers; Optical transmitters; Optical waveguides; Silicon germanium; Surface-mount technology; Wavelength division multiplexing;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927929
