Title :
New Packaging Method of Field Emission Display using Silicon-to-ITO coated glass Bonding
Author :
Jee-Won Jeong ; Ju, Byeong-Kwon ; Choi, Woo-Beom ; Leel, D. ; Lee, Yun-Hi ; Lee, Nam-Yang ; Jung, Seong-Jae ; Choi, Doo-Jin ; Oh, Myung-Hwan
Author_Institution :
Division of Electronic materials and Devices Research Center, Korea Institute of Science nnd Technology
Keywords :
Electron beams; Flat panel displays; Glass; Lithium; Packaging; Scanning electron microscopy; Silicon; Temperature; Voltage; Wafer bonding;
Conference_Titel :
Vacuum Microelectronics Conference, 1997. Technical Digest., 1997 10th International
Conference_Location :
Kyongju, Korea
Print_ISBN :
0-7803-3786-7
DOI :
10.1109/IVMC.1997.627682
