• DocumentCode
    316588
  • Title

    New Packaging Method of Field Emission Display using Silicon-to-ITO coated glass Bonding

  • Author

    Jee-Won Jeong ; Ju, Byeong-Kwon ; Choi, Woo-Beom ; Leel, D. ; Lee, Yun-Hi ; Lee, Nam-Yang ; Jung, Seong-Jae ; Choi, Doo-Jin ; Oh, Myung-Hwan

  • Author_Institution
    Division of Electronic materials and Devices Research Center, Korea Institute of Science nnd Technology
  • fYear
    1997
  • fDate
    17-21 Aug. 1997
  • Firstpage
    711
  • Lastpage
    715
  • Keywords
    Electron beams; Flat panel displays; Glass; Lithium; Packaging; Scanning electron microscopy; Silicon; Temperature; Voltage; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Microelectronics Conference, 1997. Technical Digest., 1997 10th International
  • Conference_Location
    Kyongju, Korea
  • Print_ISBN
    0-7803-3786-7
  • Type

    conf

  • DOI
    10.1109/IVMC.1997.627682
  • Filename
    627682
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=316588