The comparison of solder joint reliability between BCC++ and QFN

Author

Hung, S.C. ; Zheng, P.J. ; Ho, S.H. ; Lee, S.C. ; Wu, J.D.

Author_Institution

Adv. Semicond. Eng. Inc., Kaohsiung, Taiwan

fYear

2001

fDate

2001

Firstpage

1052

Lastpage

1058

Abstract

Since two leadless packages, BCC++ and QFN, are getting popular in the application of communication and consumer products, an attempt is made to compare the board level reliability between the two packages. Mechanical and fatigue tests are both used to evaluate the strength of their solder joints. Mechanical tests include shear and bend-to-fail of the joints. Their resistance to fatigue is evaluated through thermal cycling, cyclic bending and repetitive drop tests. The results from shear, bend-to-fail and drop tests are reported in this work, their associated failure modes are also discussed. The result of cyclic thermal and bending tests will be reported when it becomes available

Keywords

bending; failure analysis; fatigue; packaging; reliability; soldering; BCC++; QFN; bend-to-fail test; board-level reliability; cyclic bending; failure analysis; fatigue resistance; leadless package; mechanical strength; repetitive drop test; shear test; solder joint reliability; thermal cycling; Consumer products; Failure analysis; Fatigue; Lead compounds; Reliability engineering; Sawing; Semiconductor device packaging; Soldering; Testing; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927946

Filename

927946