DocumentCode :
3165958
Title :
Localized plasma processing of materials using atmospheric pressure microplasma jets
Author :
Yoshiki, H. ; Horiike, Y.
Author_Institution :
Dept. of Electr. Eng., Tsuruoka Nat. Coll. of Technol., Japan
fYear :
2002
fDate :
6-8 Nov. 2002
Firstpage :
236
Lastpage :
237
Abstract :
In this paper, an atmospheric-pressure microplasma jet driven by RF corona discharge is reported. The localized Si etching by the microplasma jet with the mixture of He/SF/sub 6/ gases is demonstrated.
Keywords :
corona; elemental semiconductors; plasma jets; silicon; sputter etching; He/SF/sub 6/ gas mixture; RF corona discharge; Si; atmospheric pressure microplasma jet; localized etching; plasma processing; Atmospheric-pressure plasmas; Etching; Fluid flow; Gases; Helium; Needles; Plasma applications; Plasma materials processing; Radio frequency; Steel;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2002. Digest of Papers. Microprocesses and Nanotechnology 2002. 2002 International
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-031-3
Type :
conf
DOI :
10.1109/IMNC.2002.1178631
Filename :
1178631
Link To Document :
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