Title :
Characterization and analysis on the solder ball shear testing conditions
Author :
Huang, Xingjia ; Lee, S. W Ricky ; Yan, Chien Chun ; Hui, Sam
Author_Institution :
Dept. of Mech. Eng., Hong Kong Univ., China
Abstract :
This paper presents both experimental investigation and computational analysis on the solder ball shear testing conditions for ball grid array (BGA) packages. The experimental data of solder ball shear tests indicate that the ram height and the shear speed have substantial effects on the solder ball shear strength. The general trend shows that lower ram height and faster shear speed can result in higher ball shear strength. A two-dimensional finite element model is established to simulate the solder ball shear tests. The results in terms of load-displacement curve from computational analysis are in good agreement with the experimental data. Based on the computational stress analysis, an effort is made to interpret the failure mode of solder balls subject to the ball shear test
Keywords :
ball grid arrays; failure analysis; finite element analysis; shear strength; soldering; stress analysis; ball grid array package; computational stress analysis; failure mode; load-displacement characteristics; ram height; shear speed; shear strength; solder ball shear testing; two-dimensional finite element model; Computational modeling; Electronics packaging; Failure analysis; Finite element methods; Laboratories; Mechanical engineering; Soldering; Stress; Surface-mount technology; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927949
