Title :
Comparison of multilayer organic and ceramic package simultaneous switching noise measurements using a 0.16 μm CMOS test chip
Author :
Budell, T. ; Audet, J. ; Kent, D. ; Libous, J. ; Connor, D.O. ; Rosser, S. ; Tremble, E.
Author_Institution :
IBM Corp., Essex Junction, VT, USA
Abstract :
This paper presents a comparison of simultaneous switching-output noise measurements taken with a 0.16 μm CMOS test chip on two flip-chip multilayer packages: IBM´s new HyperBGATM high-density PTFE-based organic BGA, and an existing IBM ASIC-menu alumina-ceramic BGA. In two classes of tests, measured transmitted noise from the organic BGA was found to average less than half that of the ceramic BGA. Technology and design features of the chip and package test vehicles are described and compared. Several types of simulations, including extracted loop inductance and full-wave simulation of coupling parameters, identify various noise components in each package and elucidate the large differences in measured noise between the two packages
Keywords :
CMOS integrated circuits; application specific integrated circuits; ball grid arrays; ceramic packaging; flip-chip devices; integrated circuit noise; integrated circuit packaging; plastic packaging; 0.16 micron; Al2O3; CMOS chip; IBM ASIC-menu alumina-ceramic BGA; IBM HyperBGA high-density PTFE organic BGA; ceramic package; coupling parameters; flip-chip multilayer package; full-wave simulation; loop inductance; organic package; simultaneous switching noise; Application specific integrated circuits; CMOS technology; Ceramics; Crosstalk; Noise measurement; Nonhomogeneous media; Packaging; Semiconductor device measurement; Signal design; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927954
