• DocumentCode
    3166275
  • Title

    Fabrication and Analysis of High-Q Inductor on Anodized Aluminum for High Power Package

  • Author

    Lee, Ju-Hyang ; Shin, Seong-Ho ; Kim, K.-M. ; Kwon, Young-Se

  • Author_Institution
    Telecommun. Network Bus., Samsung Electron. Co. Ltd., Kyungki-do
  • fYear
    2006
  • fDate
    10-15 Sept. 2006
  • Firstpage
    1387
  • Lastpage
    1390
  • Abstract
    In this paper, we fabricated high-Q inductors on anodized aluminum substrate using low-k benzocyclobutene (BCB) as an interlayer and thick Cu plating process. The 2 nH inductors on 80 mum anodized aluminum have Q-factor as high as 30 at 2 GHz and self-resonant frequency as high as 11 GHz. Anodized aluminum substrate is useful and cost-effective for high power packaging because of high thermal conductivity. Image current arises on anodized aluminum substrate because aluminum as a conductor is closely located below spiral inductors on anodized aluminum (Al2 O3) layer. Inductances of spiral inductors were calculated considering image current through Grover´s method. Thus, the influence of image current on inductance confirmed through quantitative analysis
  • Keywords
    Q-factor; aluminium; anodisation; copper; electronics packaging; electroplating; inductors; substrates; thermal conductivity; 11 GHz; 2 GHz; 80 micron; Al; Cu; Grover method; Q-factor; anodized aluminum substrate; high power package; high thermal conductivity; high-Q inductor; image current; interlayer; low-k benzocyclobutene; spiral inductors; Aluminum; Conductors; Fabrication; Frequency; Inductance; Inductors; Packaging; Q factor; Spirals; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2006. 36th European
  • Conference_Location
    Manchester
  • Print_ISBN
    2-9600551-6-0
  • Type

    conf

  • DOI
    10.1109/EUMC.2006.281295
  • Filename
    4058093