DocumentCode
3166567
Title
Processing and properties of new soluble polyimides
Author
Ezzell, S.A. ; Bai, F. ; Chien, B. ; Givot, B.L. ; Ayukawa, H. ; Kobayashi, M. ; Aoki, S.
Author_Institution
3M Center, 3M Co., St. Paul, MN, USA
fYear
2001
fDate
2001
Firstpage
1198
Lastpage
1200
Abstract
A new family of polyimides have been developed which possess useful properties for the electronics packaging, optoelectronics, and imaging applications areas. Attributes of these materials include processing ease-to give films and coatings, dielectric characteristics, and thermal and electrical stability
Keywords
dielectric thin films; packaging; polymer films; solubility; thermal stability; dielectric characteristics; electrical stability; electronic packaging; optoelectronic imaging; soluble polyimide film; thermal stability; Coatings; Dielectric films; Dielectric materials; Electronic packaging thermal management; Electronics packaging; Nitrogen; Optical films; Polyimides; Solvents; Thermal stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location
Orlando, FL
ISSN
0569-5503
Print_ISBN
0-7803-7038-4
Type
conf
DOI
10.1109/ECTC.2001.927979
Filename
927979
Link To Document