Title :
Processing and properties of new soluble polyimides
Author :
Ezzell, S.A. ; Bai, F. ; Chien, B. ; Givot, B.L. ; Ayukawa, H. ; Kobayashi, M. ; Aoki, S.
Author_Institution :
3M Center, 3M Co., St. Paul, MN, USA
Abstract :
A new family of polyimides have been developed which possess useful properties for the electronics packaging, optoelectronics, and imaging applications areas. Attributes of these materials include processing ease-to give films and coatings, dielectric characteristics, and thermal and electrical stability
Keywords :
dielectric thin films; packaging; polymer films; solubility; thermal stability; dielectric characteristics; electrical stability; electronic packaging; optoelectronic imaging; soluble polyimide film; thermal stability; Coatings; Dielectric films; Dielectric materials; Electronic packaging thermal management; Electronics packaging; Nitrogen; Optical films; Polyimides; Solvents; Thermal stability;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927979
