Processing of polymer-ceramic nanocomposites for system-on-package applications

Author

Windlass, Hitesh ; Raj, P. Markondeya ; Balaraman, Devarajan ; Bhattacharya, Swapan K. ; Tummala, Rao R.

Author_Institution

Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2001

fDate

2001

Firstpage

1201

Lastpage

1206

Abstract

This work focuses on studying and optimizing the dispersion of nano-sized ceramic particles in PGMEA, which is the solvent for the selected host polymer. High solids loading leads to entrapment of porosity in the microstructure, which lowers the effective dielectric constant of the films. The amount of solvent in the suspension and the spin coating speed were found to impact the dielectric constant of high filler content nanocomposites. The interplay between the rheological properties of the suspension and processing parameters such as solvent content and coating speed and its impact on the dielectric properties of the film is discussed. Porosity of thin film composites was measured for the first time to study the impact of these processing parameters. Powders of different particle sizes were mixed to obtain bimodal particle size distribution to increase the packing density of the composite. Packing density was improved by modifying the dispersion methodology and a nanocomposite of dielectric constant as high as 135 was obtained

Keywords

filled polymers; nanostructured materials; packaging; particle size; permittivity; porosity; spin coating; PGMEA solvent; dielectric constant; dielectric properties; dispersion methodology; filler content; microstructure; packing density; particle size distribution; polymer-ceramic nanocomposite film; porosity; rheological properties; spin coating; suspension; system-on-package; Ceramics; Coatings; Dielectric constant; Dielectric thin films; High-K gate dielectrics; Microstructure; Nanocomposites; Polymers; Solids; Solvents;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927980

Filename

927980