Title :
A new coiled microspring contact technology
Author :
Marcus, Robert B.
Author_Institution :
Murray Hill Devices Inc., NJ, USA
Abstract :
A new contact technology has been developed using coiled microsprings for making highly compliant and independent electrical contacts to chips and package. The technology uses wafer-stage fabrication only, and is based on the formation of looped microsprings by irreversible thermal curving of thin film metal bimorphs. High contact forces can be used for making temporary or permanent planar contact with intrinsic scrub action. Microsprings have been made with coil diameters in the range 30 μm to over 200 μm. Coils 60 μm diameter respond to forces in the 1-50 mN (0.1-5g) range with up to 10 μm elastic compression
Keywords :
micromechanical devices; ohmic contacts; packaging; 30 to 200 micron; coil diameters; coiled microspring contact technology; contact forces; elastic compression; electrical contacts; intrinsic scrub action; irreversible thermal curving; looped microsprings; package; thin film metal bimorphs; wafer-stage fabrication only; Biomembranes; Coils; Electronic mail; Fabrication; Ohmic contacts; Packaging; Probes; Temperature; Transistors; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927985
