High performance infrared detector arrays using thin film microstructures

Honeywell has developed a unique uncooled thermal detector technology based on fabricating thin film structures with temperature sensitive detector materials. High TCR resistive materials such as VOx and YBaCuO, and pyroelectric PbTiO₃ have been used. Two dimensional imaging arrays of sizes up to 240×336 have been integrated with Si substrate electronics to achieve temperature sensitivities of less than .04 C operating at room temperature. The thin film detector materials are deposited on microstructure thin film pixels of 2 mil sizes which are subsequently thermally isolated from the substrate by etching away the underlying substrate. The thermal isolation of the microstructure pixel provides the temperature rise and the detector material provides the conversion to an electrical signal