• DocumentCode
    3166684
  • Title

    Cationic epoxy molded electronic (Cemtronic) technology and its applications

  • Author

    Ferng, William ; Baumann, Dieter ; Lehmann, Hans ; Naganuma, Yoshi

  • Author_Institution
    Ciba-Geigy Corp., East Lansing, MI, USA
  • fYear
    1995
  • fDate
    18-21 Sep 1995
  • Firstpage
    329
  • Lastpage
    334
  • Abstract
    The characteristics of an aromatic sulfonium fluoro antimonate salt which promotes the homopolymerization of epoxies is introduced. The influence of various epoxy resins, epoxy diluents, and inorganic fillers on the reactivity of this sulfonium salt are discussed. The uniqueness of this sulfonium salt is its attended stability at room temperature and instant reactivity towards epoxies at >70°C. Additionally, only a small amount of this sulfonium salt is needed to cure epoxies. This so called “Cemtronic catalyst” has been utilized in the electronic, electrical encapsulating and casting areas. Properties of a Cemtronic encapsulating product and a Cemtronic casting system are discussed and compared with a traditional anhydride cured epoxy system
  • Keywords
    casting; encapsulation; epoxy insulation; insulators; polymerisation; transformer insulation; transformers; Cemtronic casting system; Cemtronic technology; aromatic sulfonium fluoro antimonate salt; casting; cationic epoxy molded electronic technology; electrical encapsulation; epoxies homopolymerization; epoxy diluents; epoxy resins; flyback transformer; heavy electrical insulator casting; inorganic fillers; instant reactivity; room temperature; stability; Casting; Curing; Dielectrics and electrical insulation; Epoxy resins; Flyback transformers; Mechanical factors; Paper technology; Silicon compounds; Solvents; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Electronics Insulation Conference, 1995, and Electrical Manufacturing & Coil Winding Conference. Proceedings
  • Conference_Location
    Rosemont, IL
  • Print_ISBN
    0-941783-15-4
  • Type

    conf

  • DOI
    10.1109/EEIC.1995.482385
  • Filename
    482385