• DocumentCode
    3166688
  • Title

    AMP Z-pack 2 mm HM connectors with quiet mate contacts for resolution of nanosecond discontinuity in hot-swap applications

  • Author

    Demirci, Hamdi H. ; Laub, Michael ; Fry, Charles

  • Author_Institution
    Tyco Electron., Harrisburg, PA, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    1239
  • Lastpage
    1244
  • Abstract
    The development of an innovative connector technology to resolve nanosecond discontinuities in hot-swap applications is described. Hot-swap operation has been increasingly designed in to high-data rate and high-availability telecommunications equipment with bus-type architectures. Nanosecond discontinuities are shown to exist during such mating/unmating of daughtercards while the system is running. Current CompactPCI hot-swap systems are designed with pre-charge circuitry that can react to discontinuities on the order of microseconds but they are not capable of reacting to discontinuities that only last several nanoseconds. Such nanosecond discontinuities lead to sufficient energy transfer to or from the bus to potentially alter signal levels. Quiet Mate Technology by Tyco Electronics eliminates any adverse effects of such nanosecond discontinuities on the states of monitored signals during the hot-swap event. Extensive system simulations and mechanical and electrical tests verified this technology and its effectiveness without any adverse effects on system and/or connector performance
  • Keywords
    add-on boards; electric connectors; printed circuit accessories; 2 mm; AMP Z-pack 2 mm HM connectors; CompactPCI; Quiet Mate Technology; Tyco Electronics; bus-type architectures; daughtercards; hot-swap applications; nanosecond discontinuity; pre-charge circuitry; quiet mate contacts; Circuit simulation; Circuit testing; Conducting materials; Connectors; Contacts; Electronic equipment testing; Energy exchange; Monitoring; Switches; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2001. Proceedings., 51st
  • Conference_Location
    Orlando, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7038-4
  • Type

    conf

  • DOI
    10.1109/ECTC.2001.927987
  • Filename
    927987