Title :
Si wafer bending technology for a three dimensional micro optical bench
Author :
Ishimori, M. ; Song, J.H. ; Sasaki, M. ; Hane, K.
Author_Institution :
Dept. of Mechatronics & Precision Eng., Tohoku Univ., Sendai, Japan
Abstract :
A new technique for Si wafer bending is developed for making a 3D micro optical bench (MOB). This method has freedom in the bending angle by changing the jig. This in combination with the usual machining technique eliminates the complex micromachining process, taking advantage of the 3D structure.
Keywords :
bending; elemental semiconductors; micro-optics; microactuators; micromachining; optical elements; optical fabrication; silicon; 3D micro optical bench; Si; Si wafer bending technology; bending angle; microactuator; micromachining; optical MEMS; optical component assembly; optical fabrication; Assembly; Etching; Lenses; Lithography; Mirrors; Optical devices; Optical materials; Optical sensors; Silicon compounds; Sprites (computer);
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2002. Digest of Papers. Microprocesses and Nanotechnology 2002. 2002 International
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-031-3
DOI :
10.1109/IMNC.2002.1178676
