DocumentCode
3167100
Title
Enhancement of nonceramic polymer insulator design using electrical field plot analysis
Author
Ivanov, Vsevolod ; Grisham, Thomas ; Mancoll, Rachel
Author_Institution
New Product Dev. Group, Reliable Power Products, Franklin Park, IL, USA
fYear
1995
fDate
18-21 Sep 1995
Firstpage
437
Lastpage
441
Abstract
The use of nonceramic polymer insulators (NCIs) has grown, creating a very competitive market. In order to reduce the cycle time of design work and the cost of prototype testing, the use of electrical field stress analysis software can be applied. A commercially available software package is used to model insulators under a variety of applied voltages and contamination levels to establish relative electrical stresses. These stresses can be compared with designs that have been laboratory tested to verify an electrical performance improvement. The program was used to evaluate electrical stresses on insulators with different shed placements and profiles. Accelerated aging testing was conducted at EPRI (Electric Power Research Institute), and the data verifies the prediction of the computer model. Salt fog testing was conducted to determine the relationship between electrical performance and shed placement. The program was also used to evaluate electrical stresses on insulators with different corona ring designs. Testing was conducted in laboratories, and the data once again supports the predictions of the computer model
Keywords
ageing; electric fields; insulator contamination; insulator testing; polymer insulators; power engineering computing; simulation; stress analysis; accelerated aging testing; computer model; contamination levels; corona ring designs; cycle time reduction; electrical field plot analysis; electrical field stress analysis software; electrical performance improvement; nonceramic polymer insulator design; salt fog testing; shed placements; shed profiles; Costs; Dielectrics and electrical insulation; Laboratories; Plastic insulation; Polymers; Predictive models; Software packages; Software prototyping; Software testing; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Electronics Insulation Conference, 1995, and Electrical Manufacturing & Coil Winding Conference. Proceedings
Conference_Location
Rosemont, IL
Print_ISBN
0-941783-15-4
Type
conf
DOI
10.1109/EEIC.1995.482402
Filename
482402
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