DocumentCode
3167142
Title
A new test method for embedded passives in high density package substrates
Author
Kim, Bruce C. ; Choi, Hyek Hwan
Author_Institution
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
fYear
2001
fDate
2001
Firstpage
1362
Lastpage
1366
Abstract
This paper presents a new test technique for embedded passives in Multi-Chip Module (MCM) substrates. The technique uses an active circuit to test passive circuits in MCM substrates. The defect can be found with very high sensitivity due to the natural amplification of the op amp circuit used as a test apparatus. The technique is low-cost and can be applied to many different classes of passive filters that are embedded in MCM substrates
Keywords
circuit testing; integrated circuit packaging; multichip modules; passive filters; substrates; MCM substrate; active circuit; defect sensitivity; embedded passive filter; high-density package; opamp; test method; Assembly; Capacitors; Circuit testing; Dielectric substrates; Electronics packaging; Fabrication; Filters; Integrated circuit interconnections; System testing; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location
Orlando, FL
ISSN
0569-5503
Print_ISBN
0-7803-7038-4
Type
conf
DOI
10.1109/ECTC.2001.928009
Filename
928009
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