Title :
A new test method for embedded passives in high density package substrates
Author :
Kim, Bruce C. ; Choi, Hyek Hwan
Author_Institution :
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
Abstract :
This paper presents a new test technique for embedded passives in Multi-Chip Module (MCM) substrates. The technique uses an active circuit to test passive circuits in MCM substrates. The defect can be found with very high sensitivity due to the natural amplification of the op amp circuit used as a test apparatus. The technique is low-cost and can be applied to many different classes of passive filters that are embedded in MCM substrates
Keywords :
circuit testing; integrated circuit packaging; multichip modules; passive filters; substrates; MCM substrate; active circuit; defect sensitivity; embedded passive filter; high-density package; opamp; test method; Assembly; Capacitors; Circuit testing; Dielectric substrates; Electronics packaging; Fabrication; Filters; Integrated circuit interconnections; System testing; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.928009
