Thermal characterization of plastic ball grid array packages via infrared thermography

Author

Sweatlock, Luke ; Lischner, David ; Weiss, Jeff

Author_Institution

Sch. of Appl. Phys., Cornell Univ., Ithaca, NY, USA

fYear

2001

fDate

2001

Firstpage

1367

Lastpage

1371

Abstract

A methodology for performing characterization of Plastic Ball Grid Array (PBGA) packages via Infrared Thermography (IRT) was established. The thermal performance of various assemblies was characterized using IRT in conjunction with analytical methods to determine the individual contributions of the PBGA package and of the printed wiring board. Accuracy and repeatability of temperature measurements via IRT were found to be equal to those obtained by thermocouple techniques using standard IEDEC methods. Additionally, IRT was found to provide significant advantages relative to conventional measurement techniques including increased resolution, space and time domain profiling capability, ease of use, and reduced sample preparation and measurement time

Keywords

ball grid arrays; infrared imaging; plastic packaging; temperature measurement; infrared thermography; plastic ball grid array package; printed wiring board; temperature measurement; thermal characteristics; Assembly; Electronics packaging; Extraterrestrial measurements; Measurement standards; Measurement techniques; Performance analysis; Plastic packaging; Temperature measurement; Time measurement; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.928010

Filename

928010