Study of non-anhydride curing system for no-flow underfill applications

Author

Zhang, Zhuqing ; Fan, Lianhua ; Wong, C.P.

Author_Institution

Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2001

fDate

2001

Firstpage

1474

Lastpage

1478

Abstract

Most no-flow underfill materials are based on epoxy/anhydride chemistry. Due to the its sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using non-anhydride curing system. This paper presents the development of novel no-flow underfill materials based on epoxy/phenolic resin system. Epoxy and phenolic resins of different structures are evaluated in term of their curing behavior, thermo-mechanical properties and the reliability. Compared with anhydride cured epoxy resins, epoxy/phenolic resins show high adhesion, high fracture toughness, low crosslinking density and high viscosity. The assembly with non-anhydride underfill shows high reliability during the thermal shock test. Using proper fluxing agent, no-flow underfills based on epoxy/phenolic system have been developed

Keywords

adhesion; encapsulation; fracture toughness; polymers; thermal shock; viscosity; adhesion; crosslinking density; epoxy/phenolic resin; fluxing agent; fracture toughness; no-flow underfill material; nonanhydride curing system; reliability; thermal shock testing; thermomechanical properties; viscosity; Adhesives; Chemical technology; Chemistry; Curing; Epoxy resins; Materials science and technology; Packaging; Plastics; Thermomechanical processes; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.928031

Filename

928031