Title :
Fundamental study on adhesion improvement for underfill using adhesion promoter
Author :
Welsh, D.J. ; Pearson, R.A. ; Luo, S. ; Wong, C.P.
Author_Institution :
Microelectron. Packaging Mater. Lab., Lehigh Univ., Bethlehem, PA, USA
Abstract :
In this study, silane-based, titanate-based, and zirconate-based adhesion promoters were added to a model underfill formulation in an effort to improve adhesion. Die shear tests were performed to determine adhesion strength of an underfill with passivation materials such as SiO 2 and Si3N4 before and after aging in a high temperature, high humidity environment. It was found that some adhesion promoters effectively improved the adhesion strength of epoxy underfill with passivation and its performance of adhesion retention during aging in a high temperature and high humidity environment. To further study the mechanism of hot-wet adhesion improvement via coupling agent addition to resin, flow-microcalorimetry (FMC) was used to study the the adsorption of various molecules onto a reactive surface
Keywords :
adhesion; ageing; calorimetry; delamination; encapsulation; passivation; shear strength; Si3N4; SiO2; adhesion promoter; adhesion retention; adhesion strength; aging; coupling agent addition; die shear tests; flow-microcalorimetry; hot-wet adhesion improvement; passivation material; underfill; Adhesives; Delamination; Electronic mail; Glass; Humidity; Materials science and technology; Packaging; Soldering; Surface cracks; Titanium compounds;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.928035
