Title :
Multiwavelength DFB-LD array module using self-aligned solder bump bonding
Author :
Suzuki, N. ; Muroya, Y. ; Sasaki, J. ; Yamada, H. ; Torikai, T.
Author_Institution :
Kansai Electron. Res. Lab., NEC Corp., Otsu, Japan
Abstract :
Eight-wavelength 1.55-μm DFB-LD array modules with 1.6-nm wavelength spacing have been made by self-aligned assembly using a stripe-type solder bump flip-chip bonding, and the fiber output optical power for each channel was greater than ~20 dBm. These modules are attractive low-cost multiwavelength light sources for use in WDM systems
Keywords :
distributed feedback lasers; 1.55 mum; 1.6 nm; WDM system; distributed feedback laser diode; fiber output optical power; low-cost multiwavelength light sources; multiwavelength DFB-LD array module; self-aligned assembly; self-aligned solder bump bonding; stripe-type solder bump flip-chip bonding;
Conference_Titel :
Integrated Optics and Optical Fibre Communications, 11th International Conference on, and 23rd European Conference on Optical Communications (Conf. Publ. No.: 448)
Conference_Location :
Edinburgh
Print_ISBN :
0-85296-697-0
DOI :
10.1049/cp:19971454
