A High-Performance 34 to 40 GHz Frequency Quadrupler Fabricated with Flip-Chip Technology

Author

Stoneham, Edward B.

Author_Institution

Endwave Corp., Sunnyvale, CA

fYear

2006

fDate

10-15 Sept. 2006

Firstpage

1618

Lastpage

1620

Abstract

A rugged flip-chip technology with potential for low cost at high manufacturing volume was employed to fabricate on a single substrate a frequency-quadrupling LO chain that had previously required a total of twelve wire-bonded chips in MMIC technology. A four-to-one reduction in the number of bond wires was achieved. Measurements on a typical circuit showed an output power of 17 plusmn 1 dBm over an output frequency range of 34 to 40 GHz and an input power range of 1 to 19 dBm. Spurious signal power was under -23 dBm. Self-regulating biasing with built-in bypassing simplifies the unit´s application

Keywords

MIMIC; MMIC; flip-chip devices; frequency multipliers; millimetre wave frequency convertors; 34 to 40 GHz; MMIC technology; built-in bypassing; flip-chip devices; flip-chip technology; frequency quadrupler; integrated circuit design; millimeter wave frequency conversion; millimeter wave integrated circuits; multichip modules; self-regulating bias; single substrate; wire-bonded chips; Bonding; Circuits; Costs; Frequency measurement; MMICs; Manufacturing; Power generation; Power measurement; Semiconductor device measurement; Wires; Millimeter wave frequency conversion; flip-chip devices; frequency conversion; integrated circuit design; millimeter wave integrated circuits; multichip modules;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2006. 36th European

Conference_Location

Manchester

Print_ISBN

2-9600551-6-0

Type

conf

DOI

10.1109/EUMC.2006.281410

Filename

4058155