Title :
Integrated LTCC Modules by Laminating and Co-firing Tapes Directly on Heat Sink
Author :
Lahti, Markku ; Kautio, Kari ; Karioja, Pentti
Author_Institution :
VTT, Oulu
Abstract :
A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AlN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines
Keywords :
III-V semiconductors; aluminium compounds; ceramic packaging; heat sinks; thermal conductivity; wide band gap semiconductors; AlN; CTE values; LTCC processing; buried capacitors; co-fire LTCC tapes; co-firing tapes; heat sink material options; integrated LTCC modules; optimal heat sink material; thermal conductivity; transmission lines; Capacitors; Ceramics; Conducting materials; Distributed parameter circuits; Heat sinks; MMICs; Millimeter wave technology; Permittivity; Temperature; Thermal conductivity; Ceramics; interconnections; packaging; passive circuits; radar applications; transmission lines;
Conference_Titel :
Microwave Conference, 2006. 36th European
Conference_Location :
Manchester
Print_ISBN :
2-9600551-6-0
DOI :
10.1109/EUMC.2006.281441
