New multilayer techniques actualizing active antenna hardware for wireless communication systems

We proposed new multilayer techniques in order to actualize planar active antenna hardware. We proposed a multilayer substrate that combines ceramic and polyimide substrates to realize compact active antennas, and a multilayer substrate that combines Teflon and polyimide substrates using the bump technique to realize large active antennas. The experimental results verify that the proposed multilayer substrates realize planar active array antennas that exhibit higher performance in the millimeter wave band