Title :
Comparing Single Event Upset sensitivity of bulk vs. SOI based FinFET SRAM cells using TCAD simulations
Author :
Ball, D.R. ; Alles, M.L. ; Schrimpf, R.D. ; Cristoloveanu, S.
Author_Institution :
ISDE, Vanderbilt Univ., Nashville, TN, USA
Abstract :
Single Event Upsets (SEUs), or soft errors, in SRAMs are changes of logic state due to an energetic particle depositing energy on a sensitive node within the cell. FinFETs continue to receive much attention as a next-generation silicon CMOS device structure, and have been demonstrated on bulk and SOI substrates. The small dimensions and operating voltages of these devices can make them suceptible to SEU. Here, we compare the relative SEU sensitivity of bulk and SOI FinFET SRAM cells using technology computer aided design (TCAD) simulatons. While the critical charges are comparable for the two embodiments, the larger collection volume of the bulk cell may result in upsets for lower linear energy transfer (LET) particles, as well as a larger sensitive area (SEU cross section).
Keywords :
CMOS integrated circuits; MOSFET; circuit simulation; radiation effects; random-access storage; SOI based FinFET SRAM cells; TCAD simulations; bulk based FinFET SRAM cells; energetic particle depositing energy; linear energy transfer; logic state; silicon CMOS device structure; single event upset sensitivity; soft errors; technology computer aided design; FinFETs; Logic gates; Random access memory; Single event upset; Solid modeling; Substrates; Voltage measurement;
Conference_Titel :
SOI Conference (SOI), 2010 IEEE International
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9130-8
Electronic_ISBN :
1078-621x
DOI :
10.1109/SOI.2010.5641058