• DocumentCode
    3168258
  • Title

    Comparing Single Event Upset sensitivity of bulk vs. SOI based FinFET SRAM cells using TCAD simulations

  • Author

    Ball, D.R. ; Alles, M.L. ; Schrimpf, R.D. ; Cristoloveanu, S.

  • Author_Institution
    ISDE, Vanderbilt Univ., Nashville, TN, USA
  • fYear
    2010
  • fDate
    11-14 Oct. 2010
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Single Event Upsets (SEUs), or soft errors, in SRAMs are changes of logic state due to an energetic particle depositing energy on a sensitive node within the cell. FinFETs continue to receive much attention as a next-generation silicon CMOS device structure, and have been demonstrated on bulk and SOI substrates. The small dimensions and operating voltages of these devices can make them suceptible to SEU. Here, we compare the relative SEU sensitivity of bulk and SOI FinFET SRAM cells using technology computer aided design (TCAD) simulatons. While the critical charges are comparable for the two embodiments, the larger collection volume of the bulk cell may result in upsets for lower linear energy transfer (LET) particles, as well as a larger sensitive area (SEU cross section).
  • Keywords
    CMOS integrated circuits; MOSFET; circuit simulation; radiation effects; random-access storage; SOI based FinFET SRAM cells; TCAD simulations; bulk based FinFET SRAM cells; energetic particle depositing energy; linear energy transfer; logic state; silicon CMOS device structure; single event upset sensitivity; soft errors; technology computer aided design; FinFETs; Logic gates; Random access memory; Single event upset; Solid modeling; Substrates; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference (SOI), 2010 IEEE International
  • Conference_Location
    San Diego, CA
  • ISSN
    1078-621x
  • Print_ISBN
    978-1-4244-9130-8
  • Electronic_ISBN
    1078-621x
  • Type

    conf

  • DOI
    10.1109/SOI.2010.5641058
  • Filename
    5641058