DocumentCode :
3168354
Title :
Impact of extension and source/drain resistance on FinFET performance
Author :
Matsukawa, T. ; Endo, K. ; Ishikawa, Y. ; Yamauchi, H. ; Liu, Y.X. ; O´uchi, S. ; Tsukada, J. ; Ishii, K. ; Sakamoto, K. ; Suzu, E. ; Masahara, M.
fYear :
2008
fDate :
6-9 Oct. 2008
Firstpage :
159
Lastpage :
160
Abstract :
The parasitic resistance of the FinFET is investigated by the measurement based analysis. The RS/D model suggests that careful optimization as to the NiSi incorporation is necessary for the effective Rp reduction. The Rext seriously increases the Rp for TfinLt25 nm and also causes the Rp variability due to the Tfin variation.
Keywords :
MOSFET; electric resistance measurement; ion implantation; optimisation; semiconductor device measurement; FinFET; ion implantation; optimization; parasitic resistance measurement; source-drain resistance; Conference proceedings; Electrical resistance measurement; FinFETs; MOSFETs; Metallization; Metalworking machines; Nanoelectronics; Semiconductor device modeling; Semiconductor process modeling; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 2008. SOI. IEEE International
Conference_Location :
New Paltz, NY
ISSN :
1078-621X
Print_ISBN :
978-1-4244-1954-8
Electronic_ISBN :
1078-621X
Type :
conf
DOI :
10.1109/SOI.2008.4656343
Filename :
4656343
Link To Document :
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