Title :
Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates
Author :
Ghiu, Camil-Daniel ; Dalmia, Sidharth ; Vickers, Jack ; Carastro, Larry ; Czakon, Winston ; Sundaram, Venky ; White, George
Author_Institution :
Jacket Micro Devices, Atlanta, GA
Abstract :
This paper presents the performance of 3D packaging solutions based on novel multilayered organic substrates. Electrical performance of embedded RF passives over 950 MHz to 3 GHz frequency range and stability from -40 degC to 85 degC has been demonstrated in an organic laminate substrate. Stand-alone, high Q inductors built on a multilayered liquid crystalline polymer (LCP)-based substrate can withstand a 2A direct current with the temperatures well within the safe range. The power handling capability of surface mounted IPDs is also assessed in this study. Reliability test data demonstrated the multilayer substrate compatibility with 1times and 3times lead free solder reflow. A promising high temperature LCP material enabled a significant improvement in the stability of electrical performance after 3times reflow at 260 degC
Keywords :
Q-factor; inductors; integrated circuit packaging; liquid crystal polymers; reflow soldering; -40 to 85 C; 0.95 to 3 GHz; 2 A; 260 C; advanced 3D packaging; diplexer; embedded RF passives; high Q inductors; lead free solder reflow; liquid crystalline polymer based substrates; multilayered liquid crystalline polymer; multilayered organic substrates; organic laminate substrate; power handling capability; surface mounted IPD; Crystallization; Inductors; Laminates; Liquid crystal polymers; Nonhomogeneous media; Packaging; Radio frequency; Stability; Temperature distribution; Testing; Diplexer; IPD; direct current; organics; packaging; substrate; thermal;
Conference_Titel :
Microwave Conference, 2006. 36th European
Conference_Location :
Manchester
Print_ISBN :
2-9600551-6-0
DOI :
10.1109/EUMC.2006.281486
