DocumentCode
3168801
Title
A newly developed model for stress induced slit-like voiding
Author
Kaneko, H. ; Hasunuma, M. ; Sawabe, A. ; Kawanoue, T. ; Kohanawa, Y. ; Komatsu, S. ; Miyauchi, M.
Author_Institution
Toshiba Corp., Kawasaki, Japan
fYear
1990
fDate
27-29 March 1990
Firstpage
194
Lastpage
199
Abstract
Thermodynamic analysis of stress-induced voiding has indicated that a slit-like void is the origin of metal line open failures. Wedge-shaped voids nucleate initially at specific grain boundaries where
Keywords
VLSI; aluminium; crack-edge stress field analysis; failure analysis; integrated circuit technology; metallisation; reliability; Al metallisation; degree of selective orientation; grain boundaries; metal film orientation; metal films; model; origin of metal line open failures; preventing stress-induced metal line open failure; slit-like void; spontaneous deformation; stress induced slit-like voiding; stress-induced voiding; surface free energy; thermodynamic analysis; void growth; wedge-shaped voids; Aluminum; Creep; Failure analysis; Grain boundaries; Grain size; Predictive models; Scanning electron microscopy; Shape; Tensile stress; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1990. 28th Annual Proceedings., International
Conference_Location
New Orleans, LA, USA
Type
conf
DOI
10.1109/RELPHY.1990.66086
Filename
66086
Link To Document