Title :
Integrated single and two-phase micro heat sinks under IGBT chips
Author :
Gillot, C. ; Meysenc, L. ; Schaeffer, C. ; Bricard, A.
Author_Institution :
Lab. d´´Electrotech. de Grenoble, CNRS, St. Martin d´´Heres, France
Abstract :
Experiments have been performed to assess the feasibility of single and two-phase micro heat exchangers applied to the cooling of IGBT power components. After a brief recall of the principal characteristics of such heat exchangers, prototypes that have been built and tested are described. Experimental measurements are then compared to the predictions of the thermal and hydraulic performances with water and the inert fluorocarbon liquid (FC72) as coolant fluids
Keywords :
bipolar transistor switches; cooling; heat exchangers; heat sinks; insulated gate bipolar transistors; power bipolar transistors; power semiconductor switches; semiconductor device testing; thermal analysis; IGBT power components; coolant fluids; hydraulic performance prediction; micro heat sinks; performance experiments; semiconductor device cooling; single-phase micro heat exchangers; thermal performance prediction; two-phase micro heat exchangers; Equations; Heat sinks; Heat transfer; Insulated gate bipolar transistors; Prototypes; Silicon; Space heating; Temperature; Thermal conductivity; Thermal resistance;
Conference_Titel :
Industry Applications Conference, 1997. Thirty-Second IAS Annual Meeting, IAS '97., Conference Record of the 1997 IEEE
Conference_Location :
New Orleans, LA
Print_ISBN :
0-7803-4067-1
DOI :
10.1109/IAS.1997.628982
