DocumentCode
3169017
Title
Automated fabrication of high precision planar coils
Author
Keogh, R.S.
Author_Institution
Adv. Interconnection Technol., Islip, NY, USA
fYear
1995
fDate
18-21 Sep 1995
Firstpage
517
Lastpage
519
Abstract
The purpose of this paper is to describe a new method of winding specialty coils using elements borrowed from Multiwire, a high performance circuit board manufacturing technology. Wire is ultrasonically bonded to substrate material and to other wires in desired patterns with this method such that coils may be fabricated in a wide variety of configurations without the use of special purpose fixtures
Keywords
coils; printed circuit manufacture; ultrasonic applications; Multiwire; automated fabrication; circuit board manufacturing technology; high performance; high precision planar coils; substrate material; ultrasonically bonded wire; Bonding; Conducting materials; Etching; Fabrication; Integrated circuit interconnections; Manufacturing; Printed circuits; Superconducting coils; Wire; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Electronics Insulation Conference, 1995, and Electrical Manufacturing & Coil Winding Conference. Proceedings
Conference_Location
Rosemont, IL
Print_ISBN
0-941783-15-4
Type
conf
DOI
10.1109/EEIC.1995.482485
Filename
482485
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