Title :
Automated fabrication of high precision planar coils
Author_Institution :
Adv. Interconnection Technol., Islip, NY, USA
Abstract :
The purpose of this paper is to describe a new method of winding specialty coils using elements borrowed from Multiwire, a high performance circuit board manufacturing technology. Wire is ultrasonically bonded to substrate material and to other wires in desired patterns with this method such that coils may be fabricated in a wide variety of configurations without the use of special purpose fixtures
Keywords :
coils; printed circuit manufacture; ultrasonic applications; Multiwire; automated fabrication; circuit board manufacturing technology; high performance; high precision planar coils; substrate material; ultrasonically bonded wire; Bonding; Conducting materials; Etching; Fabrication; Integrated circuit interconnections; Manufacturing; Printed circuits; Superconducting coils; Wire; Wiring;
Conference_Titel :
Electrical Electronics Insulation Conference, 1995, and Electrical Manufacturing & Coil Winding Conference. Proceedings
Conference_Location :
Rosemont, IL
Print_ISBN :
0-941783-15-4
DOI :
10.1109/EEIC.1995.482485
