Dielectric property of curing epoxy resin and application for casting processes

Author

Makishima, Satoshi ; Nakano, Toshiyuki ; Koyama, Mitsuhiko ; Inoue, Yoshiyuki

Author_Institution

Lab. of Heavy Apparatus Eng., Toshiba Corp., Tokyo, Japan

fYear

1995

fDate

18-21 Sep 1995

Firstpage

565

Lastpage

569

Abstract

Epoxy casting resin is used in heavy apparatus as insulation and structural material. To optimize epoxy casting processes, several analytic techniques are used. Different from other techniques, dielectric analysis (DEA) has the advantage of nondestructive and on-line process measurement. We tried to evaluate the cure profile of bis-phenol A type liquid epoxy casting resin with DEA, DSC and a viscometer simultaneously, and found that the ionic conduction portions of the loss factor correlated well with glass transition temperature and viscosity

Keywords

casting; dielectric loss measurement; epoxy insulation; ionic conductivity; materials preparation; viscosity; bis-phenol A type liquid epoxy casting resin; casting processes; dielectric analysis; dielectric property; epoxy resin curing; glass transition temperature; insulation material; ionic conduction; loss factor; nondestructive measurement; on-line process measurement; structural material; viscometer; viscosity; Casting; Curing; Data envelopment analysis; Dielectric materials; Dielectric measurements; Dielectrics and electrical insulation; Epoxy resins; Glass; Temperature; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Electronics Insulation Conference, 1995, and Electrical Manufacturing & Coil Winding Conference. Proceedings

Conference_Location

Rosemont, IL

Print_ISBN

0-941783-15-4

Type

conf

DOI

10.1109/EEIC.1995.482494

Filename

482494