Title :
Dielectric property of curing epoxy resin and application for casting processes
Author :
Makishima, Satoshi ; Nakano, Toshiyuki ; Koyama, Mitsuhiko ; Inoue, Yoshiyuki
Author_Institution :
Lab. of Heavy Apparatus Eng., Toshiba Corp., Tokyo, Japan
Abstract :
Epoxy casting resin is used in heavy apparatus as insulation and structural material. To optimize epoxy casting processes, several analytic techniques are used. Different from other techniques, dielectric analysis (DEA) has the advantage of nondestructive and on-line process measurement. We tried to evaluate the cure profile of bis-phenol A type liquid epoxy casting resin with DEA, DSC and a viscometer simultaneously, and found that the ionic conduction portions of the loss factor correlated well with glass transition temperature and viscosity
Keywords :
casting; dielectric loss measurement; epoxy insulation; ionic conductivity; materials preparation; viscosity; bis-phenol A type liquid epoxy casting resin; casting processes; dielectric analysis; dielectric property; epoxy resin curing; glass transition temperature; insulation material; ionic conduction; loss factor; nondestructive measurement; on-line process measurement; structural material; viscometer; viscosity; Casting; Curing; Data envelopment analysis; Dielectric materials; Dielectric measurements; Dielectrics and electrical insulation; Epoxy resins; Glass; Temperature; Viscosity;
Conference_Titel :
Electrical Electronics Insulation Conference, 1995, and Electrical Manufacturing & Coil Winding Conference. Proceedings
Conference_Location :
Rosemont, IL
Print_ISBN :
0-941783-15-4
DOI :
10.1109/EEIC.1995.482494
