DocumentCode :
3169733
Title :
The development of high sensitivity NTC thermistors
Author :
Yamamoto, Hiroshi ; Shibata, Akira ; Hajime, Keibunn ; Takao, Fumio ; Sugisawa, Katsuhiko ; Niwatsukino, Yoshiyuki ; Shishiba, Hideki ; Takeda, Shu-ichi
Author_Institution :
Komatsu Ltd., Kanagawa, Japan
fYear :
1991
fDate :
33457
Firstpage :
735
Lastpage :
738
Abstract :
Several requirements for NTC thermistors used for office automation (OA) equipment and home electronics are small size, high sensitivity and high reliability. Commonly used NTC thermistors do not have adequate reliability against thermal shock. Size reduction is difficult due to the multi-phase structure and porosity in ceramics. It is also difficult to realize the required properties because the resistivity-B value relationship control method has not been established. So we have developed a method to control the properties of NTC thermistor by controlling the numbers and the valence of solid solution ions on A and B sites in the single phase spinel structure. Based on these methods, we have also established a method to make a more dense structure. A NTC thermistor series has been developed possessing small size, high sensitivity and high reliability
Keywords :
ceramics; electric sensing devices; semiconductor device reliability; thermal shock; thermistors; valency; high sensitivity NTC thermistors; home electronics; office automation equipment; reliability; resistivity-B value relationship control method; sensitivity; single phase spinel structure; size reduction; solid solution ions; thermal shock; valence; Ball milling; Ceramics; Crystalline materials; Electric shock; Facsimile; Manufacturing processes; Office automation; Powders; Process design; Thermistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applications of Ferroelectrics, 1994.ISAF '94., Proceedings of the Ninth IEEE International Symposium on
Conference_Location :
University Park, PA
Print_ISBN :
0-7803-1847-1
Type :
conf
DOI :
10.1109/ISAF.1994.522474
Filename :
522474
Link To Document :
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