Title :
Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium. Proceedings 1989 (Cat. No.89CH2720-1)
Abstract :
The following topics are dealt with: improving manufacturing systems performance; SMT (surface mount technology) assembly and reliability; systems for continuous manufacturing improvements; high-density interconnects; design transfer; industry/university consortia centers; new developments in materials and processes; factory automation and manufacturing analysis; and inspection and test
Keywords :
assembling; design engineering; electric connectors; electronic equipment manufacture; factory automation; inspection; integrated circuit manufacture; packaging; reliability; surface mount technology; testing; SMT; assembly; design transfer; factory automation; high-density interconnects; hybrid IC; industry/university consortia centers; inspection; manufacturing analysis; manufacturing systems performance; materials developments; packaging; printed circuits; process control; reliability; semiconductor IC; surface mount technology; test;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Seventh IEEE/CHMT International
Conference_Location :
San Francisco, CA, USA
DOI :
10.1109/EMTS.1989.68941
