Achieving semiconductor equipment reliability

It is noted that the increasing complexity of semiconductor manufacturing processes and the competitiveness of worldwide device production demand step function improvements in production equipment reliability and predictability of its availability for use. The scope of the challenge to improve reliability is discussed, and a summary of key device and equipment changes forecast for the next five years is given. The present status and approach to delivering predictable equipment availability are discussed, and how this will change with time is considered. Experience at Applied Materials is reviewed. Equipment reliability attainments at Applied Materials include: system modeling; reliability specifications by module as a design parameter, and the iterative process of feedback from application laboratories and customer use for problem identification; and engineering programs for corrective action. It is predicted that continuing improvement in reliability, aided by technology to reduce the cost of delivering service to the machine in the field, will reverse the current trend toward increasing equipment ownership costs