• DocumentCode
    3169989
  • Title

    Signal conditioning electronics and packaging for the Alcator C-MOD tokamak

  • Author

    Parkin, W.

  • Author_Institution
    Plasma Fusion Center, MIT, Cambridge, MA, USA
  • fYear
    1991
  • fDate
    30 Sep-3 Oct 1991
  • Firstpage
    790
  • Abstract
    A design utilizing industry-standard EURO card packaging, connected via ribbon cable to a custom I/O backplane, accommodates the many different circuits to be used on Alcator C-MOD. The chassis approach eliminates packaging, powering, and mounting problems associated with one-of-a-kind circuits and allows dense packaging of multiple circuits. The separate I/O backplane allows easy removal and replacement of circuit cards, while leaving front panel space available for circuit-specific indicators. The DIN pin-and-socket connectors are considerably more robust and reliable than edge connectors. The pin-out allows up to four circuits per card, allowing up to eighty channels in one 5-1/2-in-tall, rack mountable chassis. A variety of general-purpose signal conditioning circuit cards was designed and built for engineering and diagnostic systems. Four channel circuits include low-drift integrators, analog multiplexers, temperature controllers, instrumentation amplifiers, transimpedance amplifiers, and an eight-pole Bessel filter for anti-aliasing applications. A two-channel card provides thermal electric cooler control. Fiber-optic interface is provided by an 8-b digital transceiver and an analog fiber-optic link
  • Keywords
    Tokamak devices; analogue-digital conversion; fusion reactor instrumentation; fusion reactor theory and design; packaging; signal processing; Alcator C-MOD tokamak; DIN pin-and-socket connectors; analog multiplexers; anti-aliasing applications; circuit-specific indicators; diagnostic systems; eight-pole Bessel filter; industry-standard EURO card packaging; instrumentation amplifiers; low-drift integrators; rack mountable chassis; signal conditioning circuit cards; temperature controllers; thermal electric cooler control; transimpedance amplifiers; Backplanes; Connectors; Design engineering; Electronics packaging; Integrated circuit reliability; Power system reliability; Reliability engineering; Robustness; Signal design; Temperature control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Fusion Engineering, 1991. Proceedings., 14th IEEE/NPSS Symposium on
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-0132-3
  • Type

    conf

  • DOI
    10.1109/FUSION.1991.218729
  • Filename
    218729