Title :
Wafer-scale packaging of RF MEMS for 50-90 GHz
Author :
Morton, Matthew A. ; Wang, Guoan ; Papapolymerou, John
Author_Institution :
Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
Abstract :
An RF MEMS capacitive membrane switch with interconnects and bonding surfaces for wafer-scale packaging is demonstrated for 50-90 GHz with un-bonded cap wafers
Keywords :
microswitches; microwave switches; semiconductor device packaging; 50 to 90 GHz; RF MEMS; bonding surfaces; capacitive membrane switch; unbonded cap wafers; wafer-scale packaging; Appropriate technology; Bandwidth; Biomembranes; Microswitches; Packaging; Power system interconnection; Radio frequency; Radiofrequency microelectromechanical systems; Switches; Wafer bonding;
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems, 2006. Digest of Papers. 2006 Topical Meeting on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-9472-0
DOI :
10.1109/SMIC.2005.1587896
