DocumentCode
3171497
Title
Integrated log-periodic antenna for Terahertz applications
Author
Yong Yuan ; Li-Ming Si ; Yong Liu ; Xin Lv
Author_Institution
Sch. of Inf. & Electron., Beijing Inst. of Technol., Beijing, China
fYear
2009
fDate
3-6 Nov. 2009
Firstpage
276
Lastpage
279
Abstract
Planar antenna has special advantages in terahertz applications; it can easy integrate other devices such diodes and SIS. Logperiodic antenna is a type of classical wide-band antenna. But planar antenna has characteristics of low gain and wide beam, and these often become disadvantages. To integrate a horn and back cavity with planar antenna is a good way overcome these disadvantages. MEMS (Micro-electromechanical Systems) technology has its benefits to manufacture very small size devices, and the accuracy can be achieved micron level. In this paper, a novel integrated log-periodic antenna at 0.9 THz totally based on MEMS technology was proposed. This kind antenna maintains the advantage of wide bandwidth of log-periodic and also has good radiation performance. The processing of this type horn antenna combine two kind MEMS techniques, silicon dry etching and silicon dry etch,. The main superiority of this kind integrated antenna is that it has more tunable parameters than other type MEMS-based antennas. From the results of analysis, we can see that integrated antennas meet demands of different applications can be well designed by optimizing these parameters.
Keywords
horn antennas; log periodic antennas; micromechanical devices; planar antennas; MEMS-based antennas; back cavity; frequency 0.9 THz; horn antenna; integrated log-periodic antenna; microelectromechanical systems technology; planar antenna; radiation performance; silicon dry etching; terahertz applications; wide-band antenna; Integrated antenna; MEMS; Planar Log-periodic antenna; Terahertz application;
fLanguage
English
Publisher
iet
Conference_Titel
Microwave Technology and Computational Electromagnetics, 2009. ICMTCE. International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-84919-140-1
Type
conf
DOI
10.1049/cp.2009.1320
Filename
5521262
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