Title :
A bandpass filter using LTCC System-on-Package (SOP) Technology
Author :
Bo Yuan ; Weihua Yu ; Houjun Sun ; Xin Lv
Author_Institution :
Dept. of Electron. Eng., Beijing Inst. of Technol., Beijing, China
Abstract :
LTCC System-on-Package (SOP) Technology is presently the most effective method for realizing the miniaturization of wireless front-end applications. In this paper, the development of highly integrated three-dimensional (3-D) filter solutions in multilayer low temperature co-fired ceramic (LTCC) technologies is presented for compact, low-cost wireless frontend modules utilizing system-on-package (SOP) technology. An asymmetrical dumbbell-shaped capacitor and wideband circuit design method was used to improve the filter characteristic. The embedded filter demonstrate an excellent performance (1L <; 1 dB, 3 dB BW 5 ≥ 27% at the centre frequency of 1.3 GHz) and great potential for high level of 3-D integration in wireless system. The BPF circuit is based on the quasi-lumped filter topology and some broadband technology was adopted. It has been simulated and optimized by Ansoft HFSS. The measured results agree very well with the full-wave electromagnetic designed responses.
Keywords :
UHF filters; band-pass filters; capacitors; ceramic packaging; microwave filters; modules; network synthesis; system-on-package; Ansoft HFSS; BPF circuit; LTCC miniaturized module; asymmetrical dumbbell-shaped capacitor; bandpass filter; embedded filter; full-wave electromagnetic designed response; highly integrated three-dimensional filter; low-cost wireless frontend modules; multilayer low temperature co-fired ceramics; quasi-lumped filter topology; system-on-package; wideband circuit design; Band Pass Filter (BPF); Low-Temperature Co-fired Ceramics ( LTCC); SOP; miniaturization;
Conference_Titel :
Microwave Technology and Computational Electromagnetics, 2009. ICMTCE. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-84919-140-1
DOI :
10.1049/cp.2009.1315
