DocumentCode :
3172361
Title :
A Si bipolar 15 GHz static frequency divider and 10 Gb/s multiplexer
Author :
Wegner, P. ; Treitinger, L. ; Wieder, A.W. ; Rein, H.-M.
Author_Institution :
Siemens AG, Munich, West Germany
fYear :
1989
fDate :
15-17 Feb. 1989
Firstpage :
222
Lastpage :
223
Abstract :
The authors describe a 16:1 divider consisting of four 2:1 divider stages and a 50- Omega output stage. The speed-limiting first stage is a master/slave D-flip-flop with inverter output fed back to the data input. The power consumption is 310 mW for the first stage, 190 mW for all three succeeding divider stages, and 40 mW for the output buffer. In contrast to III-V semiconductor dividers, the standard supply voltage of only 5 V is sufficient. The circuit design is based on an optimized 8:1 frequency divider yielding 8 GHz for a 2- mu m silicon bipolar technology with self-aligned emitter-base configuration. As is shown by the divider results, this technology is suited for data processing at high data rates, for which basic elements such as multiplexers, demultiplexers, D-flip-flops, etc. have been designed. The results indicate that data processing and communication based on ICs realized in advanced silicon bipolar technologies can be performed at data rates of 10 Gb/s and above.<>
Keywords :
bipolar integrated circuits; digital integrated circuits; elemental semiconductors; frequency dividers; integrated circuit technology; multiplexing equipment; silicon; 10 Gb/s multiplexer; 10 Gbit/s; 15 GHz static frequency divider; 16:1 divider; 2 micron; 310 mW; 5 V; 50 ohm; 50 ohm output stage; Si; bipolar frequency divider chip; inverter output; master/slave D-flip-flop; self-aligned emitter-base; speed-limiting first stage; Circuit synthesis; Data processing; Energy consumption; Frequency; III-V semiconductor materials; Inverters; Master-slave; Multiplexing; Silicon; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 1989. Digest of Technical Papers. 36th ISSCC., 1989 IEEE International
Conference_Location :
New York, NY, USA
Type :
conf
DOI :
10.1109/ISSCC.1989.48264
Filename :
48264
Link To Document :
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