Title :
LTCC technology for system in package solutions
Author :
Block, Christian ; Hagn, Peter ; Hoffmann, Christian ; Korden, Christian ; Ruppel, Clemens
Author_Institution :
EPCOS AG, Munich
Abstract :
There is a continuous trend to modularization since information, communication, data processing and automotive industries ask for integration of active and passive devices and further miniaturization. This paper shows how EPCOS, one of the leading component manufacturers is serving the needs of the industries by making use of their advanced LTCC (low temperature cofired ceramics) technology, extensive design, and assembly know-how. It will be explained how active and passive components can be embedded and matched to get smallest packages, easy to use, robust, and reliable devices
Keywords :
ceramic packaging; system-in-package; active components; low temperature cofired ceramics technology; passive components; system in package; Assembly; Automotive engineering; Ceramics industry; Communication industry; Components, packaging, and manufacturing technology; Data processing; Manufacturing industries; Packaging; Pulp manufacturing; Temperature;
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems, 2006. Digest of Papers. 2006 Topical Meeting on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-9472-0
DOI :
10.1109/SMIC.2005.1587956
