• DocumentCode
    3172552
  • Title

    Fast generation of statistically-based worst-case modeling of on-chip interconnect

  • Author

    Chang, Norman ; Kanevsky, Valery ; Nakagawa, O. Sam ; Rahmat, Khalid ; Oh, Soo-Young

  • Author_Institution
    Hewlett-Packard Co., Palo Alto, CA, USA
  • fYear
    1997
  • fDate
    12-15 Oct 1997
  • Firstpage
    720
  • Lastpage
    725
  • Abstract
    In this paper, we describe a novel methodology for obtaining statistically-based worst case (i.e. 3-σ) R (resistance), C (capacitance), and delay given variations in interconnect-related process parameters. Our approach is based on a weighted root-sum square method to derive 3-σ C. A Monte Carlo-based method is used for the generation of 3-σ R as well as randomized distributed RC nets to obtain realistic 3-σ delays for long interconnect nets such as global critical paths. Using this methodology for a long critical net analysis on a 0.35 μm process, a more than 70% improvement in 3-σ delay estimation compared with the traditional skew-corner worst case delay can be realized
  • Keywords
    VLSI; delays; integrated circuit interconnections; semiconductor device models; Monte Carlo-based method; delay; on-chip interconnect; randomized distributed RC nets; skew-corner worst case delay; statistically-based worst-case modeling; weighted root-sum square method; Capacitance; Circuit optimization; Conducting materials; Delay; Dielectric constant; Dielectric materials; Hydrogen; Integrated circuit interconnections; Planarization; Taylor series;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design: VLSI in Computers and Processors, 1997. ICCD '97. Proceedings., 1997 IEEE International Conference on
  • Conference_Location
    Austin, TX
  • ISSN
    1063-6404
  • Print_ISBN
    0-8186-8206-X
  • Type

    conf

  • DOI
    10.1109/ICCD.1997.628944
  • Filename
    628944