DocumentCode :
3172552
Title :
Fast generation of statistically-based worst-case modeling of on-chip interconnect
Author :
Chang, Norman ; Kanevsky, Valery ; Nakagawa, O. Sam ; Rahmat, Khalid ; Oh, Soo-Young
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
fYear :
1997
fDate :
12-15 Oct 1997
Firstpage :
720
Lastpage :
725
Abstract :
In this paper, we describe a novel methodology for obtaining statistically-based worst case (i.e. 3-σ) R (resistance), C (capacitance), and delay given variations in interconnect-related process parameters. Our approach is based on a weighted root-sum square method to derive 3-σ C. A Monte Carlo-based method is used for the generation of 3-σ R as well as randomized distributed RC nets to obtain realistic 3-σ delays for long interconnect nets such as global critical paths. Using this methodology for a long critical net analysis on a 0.35 μm process, a more than 70% improvement in 3-σ delay estimation compared with the traditional skew-corner worst case delay can be realized
Keywords :
VLSI; delays; integrated circuit interconnections; semiconductor device models; Monte Carlo-based method; delay; on-chip interconnect; randomized distributed RC nets; skew-corner worst case delay; statistically-based worst-case modeling; weighted root-sum square method; Capacitance; Circuit optimization; Conducting materials; Delay; Dielectric constant; Dielectric materials; Hydrogen; Integrated circuit interconnections; Planarization; Taylor series;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Design: VLSI in Computers and Processors, 1997. ICCD '97. Proceedings., 1997 IEEE International Conference on
Conference_Location :
Austin, TX
ISSN :
1063-6404
Print_ISBN :
0-8186-8206-X
Type :
conf
DOI :
10.1109/ICCD.1997.628944
Filename :
628944
Link To Document :
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