DocumentCode
3172786
Title
Low-temperature operation of silicon bipolar ECL circuits
Author
Cressler, J.D. ; Tang, D.D. ; Jenkins, K.A. ; Li, G.-P.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
1989
fDate
15-17 Feb. 1989
Firstpage
228
Lastpage
229
Abstract
Silicon bipolar transistors with current gain as high as 80 at 77 K are described. ECL (emitter-coupled-logic) circuits using these transistors are operational at low temperatures with no degradation in circuit speed observed until about 165 K as compared to its speed at a typical system operating temperature of 358 K (85 degrees C). The key design and performance issues for low-temperature operation of bipolar (or BiCMOS) circuits are addressed. The device used in the investigation is a scaled double-poly self-aligned transistor. Transistor small-signal response measured by standard S-parameter techniques as a function of temperature is shown. The static noise margin improves at low temperatures, suggesting that reduction of circuit logic swings will be possible. State gain can be greater than unity with V/sub L/ less than 200 mV at 85 K provided the pull-up resistance to emitter resistance ratio is kept sufficiently large.<>
Keywords
bipolar integrated circuits; elemental semiconductors; emitter-coupled logic; integrated logic circuits; silicon; 77 to 165 K; S-parameter techniques; Si; bipolar ECL circuits; circuit speed; current gain; design issues; emitter resistance; emitter-coupled-logic; low-temperature operation; performance issues; pull-up resistance; reduction of circuit logic swings; scaled double-poly self-aligned transistor; small-signal response; static noise margin; BiCMOS integrated circuits; Bipolar transistor circuits; Bipolar transistors; Circuit noise; Degradation; Measurement standards; Noise reduction; Scattering parameters; Silicon; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 1989. Digest of Technical Papers. 36th ISSCC., 1989 IEEE International
Conference_Location
New York, NY, USA
Type
conf
DOI
10.1109/ISSCC.1989.48266
Filename
48266
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