• DocumentCode
    3173135
  • Title

    Boost building block (B3) [DC/DC power conversion]

  • Author

    Chen, Qing ; Lotfi, Ashraf W. ; Hilburn, Del Ray

  • Author_Institution
    Lucent Technol., AT&T Bell Labs., Mesquite, TX, USA
  • fYear
    1999
  • fDate
    36312
  • Abstract
    This paper presents a method of integrating a boost converter. The basic idea is to integrate all the semiconductor devices and the snubber circuits on a ceramic substrate with an automated assembly process. This integration results in a more compact packaging of the boost converter with a better thermal performance
  • Keywords
    DC-DC power convertors; packaging; power semiconductor devices; snubbers; substrates; DC/DC power conversion; automated assembly process; boost building block; boost power convertor integration; ceramic substrate; compact packaging; semiconductor devices; snubber circuits; thermal performance; Electronic packaging thermal management; Electronics industry; Electronics packaging; MOSFETs; Power electronics; Power supplies; Snubbers; Switches; Switching circuits; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Telecommunication Energy Conference, 1999. INTELEC '99. The 21st International
  • Conference_Location
    Copenhagen
  • Print_ISBN
    0-7803-5624-1
  • Type

    conf

  • DOI
    10.1109/INTLEC.1999.794112
  • Filename
    794112
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3173135